Interconnect Technology

The interconnect centre at RAL provides a class 10,000 clean room facility and has the capability to wire-bond, flip-chip bump bonding, assembly, testing and inspection.


Chip-Chip Bonding

The centre will provide chip-to-chip, chip-to-board, board-to-board and chip to package wire-bonding using our wedge bonder or the gold ball bonder as appropriate. The flip chip bonder will provide chip-to-chip or chip-to-substrate bump bonding using gold studs or epoxy dots. Indium bump bonding process is under development for fine pitch bumps.

The interconnect centre also provides wire pull, ball shear tests, die shear test and non contact metrology using state-of-the-art equipment.

Download Interconnect Technology's list of equipment (PDF - link opens in a new window).

 

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